Intel Wins SEMI Award at SEMICON West for Process and Integration


Reading time ( words)

Intel has won SEMI’s 2018 Award for the Americas. SEMI honored the celebrated chipmaker for pioneering process and integration breakthroughs that enabled the first high-volume Integrated Silicon Photonics Transceiver. The award was presented yesterday at SEMICON West 2018.

SEMI’s Americas Awards recognize technology developments with a major impact on the semiconductor industry and the world. 

The Intel Silicon Photonics 100G CWDM4 (Coarse Wavelength Division Multiplexing 4-lane) QSFP28 optical transceiver, a highly integrated optical connectivity solution, combines the power of optics and the scalability of silicon. The small form-factor, high-speed, low-power consumption 100G optical transceivers are used in optical interconnects for data communications applications, including large-scale cloud and data centers, and in Ethernet switch, router, and client telecommunications interfaces.

Dr. Thomas Liljeberg, senior director of R&D for Intel Silicon Photonics, accepted the award on behalf of Intel. Dr. Liljeberg is one of the technologists responsible for bringing Intel’s silicon photonics 100G transceivers to high-volume production.

“Every year SEMI honors key technological contributions and industry leadership through the SEMI Award,” said David Anderson, president, SEMI Americas. “Intel was instrumental in delivering technologies that will influence product design and system architecture for many years to come. Congratulations to Intel for this significant accomplishment.”

“The 2018 Award recognizes the enablement of high-volume manufacturing through technology leadership and collaboration with key vendors in the supply chain,” said Bill Bottoms, chairman of the SEMI Awards Advisory Committee. “Intel’s collaboration is a model for how the industry can accelerate innovation in the future.” 

SEMI established the SEMI Award in 1979 to recognize outstanding technical achievement and meritorious contributions in the areas of Semiconductor Materials, Wafer Fabrication, Assembly and Packaging, Process Control, Test and Inspection, Robotics and Automation, Quality Enhancement, and Process Integration.

The SEMI Americas award is the highest honor conferred by the SEMI Americas region. It is open to individuals or teams from industry or academia whose specific accomplishments have a broad commercial impact and widespread technical significance for the entire semiconductor industry. Nominations are accepted from individuals of North American-based member companies of SEMI.

About SEMI

SEMI connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C.  For more information, click here.

 

 

Share


Suggested Items

DARPA, Santa Continue HO HO HO-liday Team-Up

12/26/2017 | DARPA
DARPA’s High-speed Optimized Handling of Holiday Operations (HO HO HO) initiative is celebrating its fourth anniversary this year, and the Agency is proud to continue its tradition of sharing breakthrough technologies to help Santa Claus and his elves more quickly and efficiently complete their holiday duties.

The Incredible Loudness of Whispering

09/05/2016 | DARPA
In a vision shared by innovators, entrepreneurs, and planners in both defense and civilian contexts, the skies of the future will be busy with unmanned aerial vehicles (UAVs).

DARPA HO HO HOpes to Give Santa’s Workshop a High-Tech Makeover

12/28/2015 | DARPA
DARPA has announced it is extending its High-speed Optimized Handling of Holiday Operations (HO HO HO) initiative, which the Agency launched last year to help Santa Claus and his elves more quickly and efficiently complete their holiday duties.



Copyright © 2018 I-Connect007. All rights reserved.