Technology to Toughen Mobile Phone Screens
August 22, 2019 | University of LeedsEstimated reading time: 3 minutes
A University of Leeds spin-out which is pioneering a new way to make toughened glass for mobile phone screens and wearable devices has secured £600,000 to prove the benefits of its technology.
Optimus Vitrum has received backing from NPIF—Mercia Equity Finance, which is managed by Mercia and is part of the Northern Powerhouse Investment Fund as well as the University and a private investor.
The company believes its technology could help resolve a key challenge facing the global mobile industry—how to create thinner, more flexible screens for smartphones and other electronic devices without making them more vulnerable to cracking.
Optimus Vitrum’s process, which is based on research by materials specialist Professor Gin Jose, from the School of Chemical and Process Engineering, uses lasers instead of chemicals to treat the glass, resulting in more uniform toughening and better performance. The investment will allow the company to create advanced prototypes and engage customers.
Professor Jose spent seven years developing the technology, attracting over £5million in government grants. He has now joined forces with his former University PhD students, Dr Matthew Murray and Dr Robert Mathieson, and glass industry expert Dr Malcolm Glendening to set up Optimus Vitrum. The company, which has recently moved into new premises in Leeds, has also appointed entrepreneur Chris Brill as chair.
The global market for mobile phone and tablet screens is estimated at $2.1bn and expected to reach $2.5bn by 2025. However, cracking appears to be a common problem even at current glass thicknesses - one survey found that almost one in four UK mobile users had had a cracked screen in the last two years.
Market Disruptor
Professor Jose, Director at Optimus Vitrum, said: “Our process has the potential to disrupt the glass market, in particular the way glass is toughened—a process that has remained largely unchanged for decades. The practical benefit is that industry will be able to make glass that is thinner and stronger and also more resistant to scratches. ”
Dr Arshad Mairaj, Head of Commercialisation at the University of Leeds, said: “The University of Leeds has a strong track record of turning its research into commercial ventures. That holds true for Optimus Vitrum which has the potential to transform an important industrial process and bring significant impact to businesses and the public.
“The philosophy at Leeds is to work closely with the wider investor community and to co-invest when launching our spin-outs. We are pleased to continue supporting Optimus Vitrum, so industry can get rapid access to this new technology.
"The University is also home to Nexus, our new innovation hub, which will build on this success where we can provide seamless access to the expertise, talent and facilities of the University.”
Chris Brill, Chair—Optimus Vitrum, said: “It’s not often that a new technology comes along with the potential to change the way an industry operates but that is exactly the case with Optimus Vitrum.
"Toughening glass is a key industrial process and the new technology will revolutionise that process. For me as an entrepreneur, it is exciting to work with a start-up that will have such a big impact.”
Huge Market
Ken Cooper, Managing Director at British Business Bank, said: “This is a great example of how NPIF funding can support innovative businesses in the North of England. The success of companies like Optimus Vitrum will provide the fuel for the Northern Powerhouse and help to redress the current imbalances in the UK’s economy.”
Maurice Disasi, Investment Associate with Mercia said: “Optimus Vitrum’s technology addresses a key challenge for manufacturers and could have a huge potential market, not only in mobile phones but also for uses such as vehicle windscreens. This investment will fund independent tests and provide the proof the company needs to approach customers worldwide.”
The Northern Powerhouse Investment Fund project is supported financially by the European Union using funding from the European Regional Development Fund (ERDF) as part of the European Structural and Investment Funds Growth Programme 2014-2020 and the European Investment Bank.
Suggested Items
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations
Intel Brings AI-Platform Innovation to Life at the Olympic Games
04/18/2024 | BUSINESS WIREIntel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.
Adura Solutions Exhibits at Del Mar 2024
04/18/2024 | Adura SolutionsSumit Tomar, CEO of Adura Solutions, has announced that his company will be exhibiting at this year's Del Mar Electronics and Manufacturing Show to be held at the Del Mar Fairgrounds, San Diego, California, April 24-25.
Australian Flow Batteries and The SCHMID Group Announce Groundbreaking Memorandum of Understanding
04/17/2024 | SCHMID GroupAustralian Flow Batteries Pty Ltd (AFB), a leader in innovative energy solutions and economical, safe, and reliable power storage, and SCHMID Energy Systems GmbH a company of the German SCHMID Group, a global technology leader with a rich history in delivering innovative solutions across multiple industries including Electronics, Renewables, and Energy Storage sectors, are thrilled to announce the signing of a Memorandum of Understanding (MoU)
Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense
04/16/2024 | ANSYSAnsys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).