-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Meet Industry Experts at the 2019 International Electronics Circuit Exhibition (Shenzhen)!
November 15, 2019 | HKPCAEstimated reading time: 1 minute
The International Technical Conference, to be held concurrently with the 2019 International Electronics Circuit Exhibition (Shenzhen) (formerly International Printed Circuit & APEX South China Fair), gives you valuable insights on the latest market trends to prepare you to face challenges and transform your business to a new level. Join us for the Conference at the Shenzhen Convention & Exhibition Center, China, 4-6 December 2019.
Stay on top with the industry leaders and experts
The 2019 Conference will feature international specialists and industry experts to address the hottest topics covering both market trend and technical updates of the industry. Here are some hot sessions that you can't miss!
- Keynote Speeches from Mr Canice Chung and Mr. You Lei, Chairmen HKPCA
- The Challenge and Opportunity of 5G High Frequency to PCB and PCBA, Mr. Liu Zhe Chief Engineer, ZTE Corporation
- Which Way is the PCB Industry Heading? Dr. Hayao Nakahara, President, N.T. Information Ltd.
- PCB Market Update, Dr. Shiuh-Kao Chiang, Managing Partner, Prismark
- IC Substrate Technology Characteristics Study, Mr. Lin Ting Hao, Sr. Project Director, Kinsus Interconnect Technology Corp.
- Challenges and Opportunity to PCB Material and Processing Technology from Automotive Electronics, Mr. James Tam, Project Manager, Robert Bosch Co., Ltd.
Get the latest show news at HKPCAshow.org.
Suggested Items
The New Chapter: Attracting ‘Generation Green’
03/28/2024 | Hannah Grace & Paige Fiet -- Column: The New ChapterIn the electronics industry, we talk a lot about sustainability in terms of recruitment and retention of the next generation of engineers. But what if the key to sustaining the industry long into the future is through the more common definition of the word? What if, for just a moment, we think about sustainability in terms of the environment and what we as an industry are doing to care for it? Because, if you weren’t aware, Gen Z cares tremendously about the environment and the actions companies are taking to preserve it. Without Gen Z joining the electronics industry’s workforce, we won’t be able to sustain the industry for much longer.
Accenture Invests in Sanctuary AI to Bring AI-Powered, Humanoid Robotics to Work Alongside Humans
03/27/2024 | BUSINESS WIREAccenture has made a strategic investment, through Accenture Ventures, in Sanctuary AI, a developer of humanoid general-purpose robots that are powered by AI and can perform a wide variety of work tasks quickly, safely and effectively.
Don Dennison Appointed to Roll Out KIC’s Latest Thermal Analysis System Software in the Northeast
03/26/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is pleased to announce the appointment of PIT Equipment Services, LLC, led by Don Dennison, as its representative for New York, New Jersey, and Eastern Pennsylvania.
iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs
03/25/2024 | IPCToday’s system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.
Seeking Employment: Meet Gary Turner
03/25/2024 | Barry Matties, I-Connect007Meet Gary Turner, a recent graduate from the University of Texas at Dallas with a bachelor’s degree in mechanical engineering and a master’s in material science and engineering. He is currently seeking employment in the industry. The following interview will allow you to learn about Gary and see if he might be a good candidate for a position you are looking to fill.