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IDTechEx Discusses the Role of Printed Sensors in Mass-Digitization

04/11/2024 | PRNewswire
Integrated sensors digitizing physical interactions are vital in everyday life. From personalized user experiences to warehouse inventory management, data-driven insights are driving demand for smarter sensors — and lots of them.

MKS Introduces ESI Geode G2 CO2 Laser System for High- Precision and High-Speed HDI and mSap Via Drilling

04/09/2024 | MKS Instruments, Inc.
MKS Instruments, Inc., a global provider of technologies that transform our world, today announced the official launch of the ESI Geode™ G2 laser drill system, the next generation of the Geode™ platform for processing PCB and ICP materials. 

DuPont Unveils Pyralux ML Laminate Series, Offering High Thermal Management for Extreme Environments

04/09/2024 | DuPont
DuPont introduced the DuPont™ Pyralux® ML Series of double-sided metal-clad laminates, a unique addition to its extensive family of Pyralux® laminates for flexible and rigid-flex printed circuit boards (PCBs).

A Closer Look at Professional Development at IPC APEX EXPO 2024: 3D Printing and AI

04/09/2024 | I-Connect007 Editorial Team
While the finishing touches were being made to the show floor at IPC APEX EXPO, just as much activity was happening in the conference rooms of the Anaheim Convention Center on the days before the show officially opened. The hallways and classrooms were filled for standards committee development meetings and Professional Development Courses, and IPC hosted evening receptions for Emerging Engineers, ECWC, and those who are attending for the first time in a special “newcomers” event.

IDTechEx Discusses AiP Market Dynamics: Drivers and Challenges in 5G and 6G

04/04/2024 | PRNewswire
Antenna-in-package (AiP) technology is essential for high-frequency telecommunications, as it enables the integration of antennas with RF components directly into semiconductor packages, unlike traditional discrete antennas.
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