TE Connectivity Acquires Majority Share of First Sensor AG
March 12, 2020 | TE ConnectivityEstimated reading time: 1 minute
TE Connectivity Ltd., a global industrial technology company with leading positions in connectivity and sensing solutions, completed its public takeover of First Sensor AG (XTRA: SIS). TE now holds 71.87% shares of First Sensor.
First Sensor, founded as a technology start-up in the early 1990s, is a global player in sensor technology. With its expertise in chip design and production, as well as microelectronic packaging, it develops and produces standard sensors and customer-specific sensor solutions in the fields of photonics, pressure and advanced electronics for applications within the industrial, medical and transportation markets. It has six German locations along with development, production and sales sites in the USA, Canada, China, the Netherlands, Great Britain, France, Sweden and Denmark, along with a worldwide partner network.
In combining the First Sensor and TE portfolios, TE will be able to offer an even broader product base, including innovative, market-leading sensors, connectors and systems plus best-in-class capabilities, that supports the growth strategy of TE's sensors business and TE Connectivity as a whole. First Sensor provides market expansion opportunity with optical sensing applications for industrial, heavy truck and auto applications.
"The business combination with First Sensor is yet another milestone in TE Connectivity's commitment to being a leader in the sensor space and continuing to provide customers with a high level of product innovation and service," said John Mitchell, senior vice president and general manager of TE's sensors business. "The First Sensor team's capabilities, as well as their products, strongly align with the markets we serve and create greater opportunity to serve our customers."
Suggested Items
Australian Flow Batteries and The SCHMID Group Announce Groundbreaking Memorandum of Understanding
04/17/2024 | SCHMID GroupAustralian Flow Batteries Pty Ltd (AFB), a leader in innovative energy solutions and economical, safe, and reliable power storage, and SCHMID Energy Systems GmbH a company of the German SCHMID Group, a global technology leader with a rich history in delivering innovative solutions across multiple industries including Electronics, Renewables, and Energy Storage sectors, are thrilled to announce the signing of a Memorandum of Understanding (MoU)
Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense
04/16/2024 | ANSYSAnsys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).
Microchip Technology Acquires Neuronix AI Labs
04/16/2024 | Microchip Technology Inc.Innovative technology enhances AI-enabled intelligent edge solutions and increases neural networking capabilities.
Incap Estonia Teamed Up With Solaride to Fuel Youth Excitement for The World of Engineering
04/11/2024 | IncapIncap Estonia partnered with Solaride to ignite enthusiasm among young people for the world of engineering and sustainable technology. Together, they organised an inspiring day for students from grades 7 through 12 in Saaremaa. Held at Incap’s Kuressaare factory, this event brought together over 130 young minds eager to explore the innovative world of technology and learn more about advanced electronics manufacturing.
Plastronics and the New IPC Guidelines for In-mold Electronics (IME)
04/11/2024 | Barry Matties, I-Connect007In the ever-evolving world of electronics, the roads for the integration of electronics assemblies into 3D structures continue to grow into a set of technologies used to produce 3D plastronics parts and revolutionize mainly the automotive industry. IPC has been developing standards for this set of technologies, led by Francisco Fourcade, IPC electronics technology standards manager.