Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

IDTechEx Report Unveils 3D Electronics Status and Opportunities

04/22/2024 | PRNewswire
3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. 3D electronic manufacturing techniques empower new features, including mass customizability, greater integration, and improved sustainability in the electronics industry.

Microsoft, Google Join as Sponsors for First-Ever AI Expo for National Competitiveness

04/19/2024 | SCSP
The Special Competitive Studies Project (SCSP), a non-partisan, non-profit project dedicated to strengthening America’s long-term competitiveness in artificial intelligence (AI), announced today two additional sponsors of the AI Expo for National Competitiveness.

Scape Technologies Introduces SCAPE CoCreator at Hannover Messe 2024

04/18/2024 | Scape Technologies
Today's industrial robotics, 3D Vision, and AI are often confined by costs, complexity, and limited accessibility and usability. Scape Technologies is revolutionizing this field by broadening the horizons of what is possible.

Micron’s Full Suite of Automotive-Grade Solutions Qualified for Qualcomm Automotive Platforms to Power AI in Vehicles

04/17/2024 | Micron
Micron Technology, Inc. announced that it has qualified a full suite of its automotive-grade memory and storage solutions for Qualcomm Technologies Inc.’s Snapdragon® Digital Chassis™, a comprehensive set of cloud-connected platforms designed to power data-rich, intelligent automotive services.

SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1

04/17/2024 | Dr. Jennie Hwang -- Column: SMT Perspectives and Prospects
In this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and assembly.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in