IWLPC Panel Addresses Future Advanced Packaging Challenges
October 7, 2020 | IWLPCEstimated reading time: Less than a minute
The International Wafer-Level Packaging Conference and Expo announces a panel discussion titled “Meeting Future Advanced Packaging Challenges: What's Next?” The live discussion will commence on Wednesday, October 14, 2020 at 9:00am US Pacific Time.
The panel will discuss challenges and possible solutions to advancements in heterogeneous integration, high density substrates, and Fan-Out Wafer-Level Packaging (FO-WLP) as they impact material selection, design and fabrication of features, inspection, test, and reliability. Attendees will be able to submit questions and get responses in real-time from the expert panel.
Panelists include Tim Olson, DECA; Tanja Braun, Ph.D., Fraunhofer IZM; Rahul Manepalli, Ph.D., Intel Corporation; Max Min, Ph.D., Samsung Foundry; and Shin-Puu Jeng, Ph.D., TSMC. The panel is moderated by E. Jan Vardaman, TechSearch International, Inc.
The panel discussion is open to all registered attendees. The technical conference and expo are available on-demand from October 13-30 with a live, online exposition enabled October 13 and 14. Details are available at iwlpc.com.
Suggested Items
Impact of the April 3rd Earthquake on Taiwan’s Display Panel Industry Is Expected to Bolster Panel Prices
04/03/2024 | TrendForceAn earthquake with a magnitude of 7.2 occurred off the eastern coast of Taiwan at 7:58 AM on April 3rd. Continuous aftershocks have left most machinery at AU Optronics and Innolux in a state of shutdown.
SEMI ESD Alliance 2024 CEO Executive Outlook to Explore the Evolving RISC-V Movement and Semiconductor Design Ecosystem
03/27/2024 | SEMIKey executives from leading semiconductor EDA and IP companies will gather to discuss the latest industry trends, challenges and opportunities Thursday, May 9, in Santa Clara, California at the annual CEO Executive Outlook, hosted by the Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, and Keysight Technologies. Registration opens soon.
IPC APEX EXPO 2024: LPKF—Debunking Depaneling Industry Perceptions
03/27/2024 | Nolan Johnson, I-Connect007In this audio interview, listen to Jake Benz discuss advances in laser depaneling at LPKF. Thanks to advances in laser technology, perceptions about laser depaneling are changing from a low-speed, specialized process to a high volume process suitable for production manufacturing. Benz elaborates on some of the development and engineering that went into creating their latest, most capable depaneling machines.
SMTA Announces Workforce Development Breakfast at Ultra High Density Interconnect (UHDI) Symposium
03/13/2024 | SMTAThe SMTA is excited to announce a Workforce Development Breakfast Panel, “Building Tomorrow’s Expertise,” taking place on March 26, 2024 in Peoria, Arizona, USA.
AEM, Texas Aerospace Technologies Bolster Partnership for Latin America
02/26/2024 | AEM Corp.Canadian avionics manufacturer, Anodyne Electronics Manufacturing Corp. (AEM), is pleased to announce a partnership expansion with Texas Aerospace Technologies, a subsidiary of Texas Aerospace Services, to add AEM’s new MTP136D modern panel-mount P25 VHF FM Forest Service radio to its lineup of product offerings for their Latin American customers.