STMicroelectronics Joins Startup Autobahn as Anchor Partner to Meet Tomorrow’s Automotive Innovators
July 23, 2021 | Globe NewswireEstimated reading time: 1 minute
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has become an Anchor Partner of Startup Autobahn, which is powering innovation in the automotive sector by introducing selected dynamic new companies to established technology corporations.
Startup Autobahn is created and managed by Plug and Play, the accomplished Silicon Valley accelerator and investor that historically has introduced over 35,000 startups to more than 400 corporations.
Anchor Partners in Startup Autobahn include major car brands and vendors of diverse automotive technologies. ST’s support, with its strategic emphasis on smart mobility, boosts opportunities for new companies with innovative ideas for electrification, e-mobility, and smart, connected driving to take part in the program.
Welcoming ST to the program, Sascha Karimpour, Managing Director Plug and Play Germany, said, “We’re extremely pleased to welcome STMicroelectronics to our platform as a new strategic partner. This partnership fits perfectly into our existing ecosystem, covering the automotive value chain. The semiconductor industry is currently enabling powerful innovations in automotive technology and will play a major role as software and IT become increasingly important in the car of the future.”
Alessandro Cremonesi, Chief Innovation Officer for STMicroelectronics, added, “Joining Startup Autobahn extends our broad commitment to nurture the technologies that will define tomorrow, and in this case, the automotive world, by making transport safer, greener, and more connected. We are looking forward to discovering new product concepts and discussing ways to invest and make them happen.”
Startup Autobahn organizes events throughout the year to bring corporate partners and selected startups together. The diverse platforms include deep-dive presentations, one-to-one introductions, cross-collaboration days, and private meetings between partners and shortlisted startups. Twice-yearly expos showcase the results of collaborations, combined with keynote speeches and presentations from various industry leaders and invited guests.
The program has already successfully connected startups with established brands to activate powerful new concepts in areas such as battery charging, supply-chain and materials management, smart mobility, efficient manufacturing, recycling, and enterprise CO2 reduction.
Suggested Items
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024
05/01/2024 | SEMIWorldwide silicon wafer shipments decreased 5.4% quarter-over-quarter to 2,834 million square inches in the first quarter of 2024, a 13.2% drop from the 3,265 million square inches recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.
Guerrilla RF Completes Strategic Acquisition of GaN Device Portfolio from Gallium Semiconductor
04/29/2024 | BUSINESS WIREGuerrilla RF, Inc. has finalized the acquisition of Gallium Semiconductor's entire portfolio of GaN power amplifiers and front-end modules. Effective April 26th, 2024, GUER acquired all previously released components as well as new cores under development at Gallium Semiconductor.
SIA Commends CHIPS Act Incentives for Micron’s Manufacturing Projects in New York and Idaho
04/29/2024 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Micron.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.