2021 Global Semiconductor Equipment Sales Surge 44% to Industry Record $102.6B
April 13, 2022 | SEMIEstimated reading time: 1 minute
Worldwide sales of semiconductor manufacturing equipment in 2021 surged 44% to an all-time record of $102.6 billion from $71.2 billion in 2020, SEMI, the industry association representing the global electronics product design and manufacturing supply chain, reported. The data is now available in the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
China claimed the largest market for semiconductor equipment for the second time with sales expanding 58% to $29.6 billion to mark the fourth consecutive year of growth. Korea, the second-largest equipment market, registered a sales increase of 55% to $25.0 billion, after showing strong growth in 2020. Taiwan logged 45% growth to $24.9 billion to claim the third position. Annual semiconductor equipment spending increased 23% in Europe and 17% in North America, which continues to recover from a contraction in 2020. Sales in Rest of the World jumped 79% in 2021.
“The 44% increase in manufacturing equipment spending in 2021 highlights the global semiconductor industry’s aggressive push to add capacity,” said Ajit Manocha, SEMI president and CEO. “This drive to expand production capabilities extends beyond the current supply imbalance, as the industry continues to ramp up to address a wide range of emerging high-tech applications that will enable a smarter digital world with countless social benefits.”
Global sales of wafer processing equipment rose 44% in 2021, while other front-end segment sales grew 22%. Assembly and packaging showed exceptional growth across all regions, resulting in an 87% market increase in 2021, while total test equipment sales rose 30%.
Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the Worldwide SEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. Equipment categories cover wafer processing, assembly and packaging, test, and other front-end equipment including mask/reticle manufacturing, wafer manufacturing, and fab facilities.
Suggested Items
DDM Novastar Unveils Affordable NovaPlace Automatic Pick and Place Systems
05/06/2024 | DDM Novastar Inc.DDM Novastar, a prominent U.S. manufacturer specializing in SMT and PCB assembly equipment, proudly announces the recent launch of their NovaPlace Pick & Place systems. This new line introduces entry-level yet high-performance pick and place machines.
May Issue of SMT007 Magazine: Coming to Terms With AI
05/06/2024 | I-Connect007 Editorial TeamIn the May 2024 issue of SMT007 Magazine, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
05/02/2024 | BUSINESS WIRENature published an Intel research paper, “Probing single electrons across 300-mm spin qubit wafers,” demonstrating state-of-the-art uniformity, fidelity and measurement statistics of spin qubits.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.