AISIN Selects Siemens’ Capital VSTAR for AUTOSAR Electronic Control Unit Development
April 20, 2022 | SiemensEstimated reading time: 1 minute
Siemens Digital Industries Software announced that AISIN Corporation, a component supplier to many of the world’s largest automotive original equipment manufacturers (OEMs), has expanded its investment in Siemens’ Capital VSTAR software portfolio.
Capital VSTAR is Siemens’ implementation of the AUTOSAR standard, the foremost specification for the development of automotive embedded software and a key enabler for generative software development. AUTOSAR provides development partners a common standard to integrate, re-use and transfer functions within a vehicle’s E/E (electrical/electronic) architecture, which can substantially improve software development efficiency. AISIN uses Siemens’ Capital VSTAR software to develop and integrate electronic control units (ECUs).
“Siemens’ dedication to AISIN’s success is reinforced by our continued commitment to use the Capital toolchain and Capital VSTAR solutions in key projects for our most important customers,” said AISIN’s technical leader for software platforms. “We selected Siemens once again because the Capital software portfolio meets the very specific needs of AISIN, our development partners and our customers. Using Capital also helps us to standardize on a single vendor, which simplifies relationships and streamlines processes.”
AISIN previously secured full approval from a leading Japanese OEM to use the Siemens’ VSTAR technology portfolio in the carmaker’s vehicle programs. Capital VSTAR technology enables continuous integration workflows, which are critical to successful automotive software development for next-generation cars. Capital also provides a common solution and standard for multiple OEMs, in turn providing cost savings and streamlining development cycles for the design of next-generation ECUs. From requirements through to delivery, Siemens’ comprehensive VSTAR AUTOSAR solution helps Siemens’ customers produce compelling and highly differentiated ECUs on schedule.
“Siemens is pleased to continue our very productive partnership with AISIN,” said Henrik Olsén, product director for the IES division of Siemens Digital Industries Software. “We look forward to helping AISIN continue to succeed with many of their most innovative and compelling upcoming projects.”
Suggested Items
Micron First to Ship Critical Memory for AI Data Centers
05/01/2024 | MicronMicron Technology, Inc. announced it is leading the industry by validating and shipping its high-capacity monolithic 32Gb DRAM die-based 128GB DDR5 RDIMM memory in speeds up to 5,600 MT/s on all leading server platforms.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.
GPV’s Q1 2024 Interim Financial Report Shows Strong Navigation in Uncertain Times
05/01/2024 | GPVDanish-based GPV recorded an expected drop in sales to DKK 2.3 billion for the first quarter of 2024. The decline also affected the operating profit, which was DKK 155 million compared to DKK 179 million in the same quarter last year, although the EBITDA margin was maintained. In general, demand has been softer in 2024, but GPV continues to invest for the long-term and expects the trend to turn in the second half of 2024.
The Knowledge Base: A CM’s Perspective on Box Build Practices
04/30/2024 | Mike Konrad -- Column: The Knowledge BaseIn the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/26/2024 | Andy Shaughnessy, Design007 MagazineIn this week’s roundup, we have a variety of articles covering everything from design through assembly, and even box build. I’ve always wondered whether box build was all it was cracked up to be. Do customers really pick one EMS provider over another because one company offers box build? And if you’ve ever wanted to volunteer, IPC’s Thought Leaders Program is looking for a few good technologists to help them on their mission. Check out Stanton Rak’s article, which was published in the spring issue of IPC Community.