Samsung Electronics and AMD Extend Strategic IP Licensing Agreement
April 6, 2023 | Business WireEstimated reading time: 1 minute
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, and AMD announced they have signed a multi-year agreement extension to bring multiple generations of high-performance, ultra-low-power AMD Radeon graphics solutions to an expanded portfolio of Samsung Exynos SoCs. Through the licensing extension, Samsung will bring console-level graphics quality and optimized power consumption to more mobile devices, offering an incredibly immersive and long-lasting gaming experience.
“Together with AMD, Samsung has been revolutionizing mobile graphics, including our recent collaboration that brought ray tracing capability to mobile processors for the first time in the industry,” said Seogjun Lee, executive vice president of Application Processor (AP) Development at Samsung Electronics. “Drawing on our technological know-how in designing ultra-low-power solutions, we will continue to drive ongoing innovation in the mobile graphics space.”
“We are excited Samsung selected multiple generations of our leadership high-performance Radeon graphics to advance the next generation of Samsung Exynos solutions,” said David Wang, senior vice president of the Radeon Technologies Group at AMD. “The extension of our work with Samsung is a testament to our strong technology partnership and commitment to bring the best experiences possible to mobile users.”
Samsung and AMD first announced their partnership to license AMD RDNA™ graphics architecture in 2019, leading to the co-development of Samsung Xclipse, a mobile graphics processing unit (GPU) based on the AMD RDNA 2 architecture in 2022. Xclipse was the industry’s first mobile GPU with hardware-accelerated ray tracing and variable rate shading features for console-like gameplay on mobile devices.
Suggested Items
Real Time with… IPC APEX EXPO 2024: Outlining Rehm's Innovations and Global Presence
05/01/2024 | Real Time with...IPC APEX EXPOMichael Hanke, the chief sales officer for Rehm Thermal Systems, shares insights on the North American market, new machinery, and software development. He also discusses Rehm's turnkey solutions, process flexibility, global presence, and the dedicated team of 700 employees working on global solutions.
Real Time with… IPC APEX EXPO 2024: The Latest Advancements in Dry Storage
04/30/2024 | Real Time with...IPC APEX EXPOEditor Marcy LaRont and Super Dry Totech's Jordan Mandel discuss the latest developments in dry storage solutions, the J standard, and the ongoing challenge of moisture management while highlighting the industry's shift toward smart solutions and the importance of seeking expert help for moisture mitigation.
Keysight Secures New Test Case Validations for Narrowband Non-Terrestrial Networks Standard
04/30/2024 | Keysight TechnologiesKeysight Technologies, Inc. has validated new conformance test cases for 3rd Generation Partnership Project (3GPP) Release 17 (Rel-17) standards for non-terrestrial networks (NTN) using narrowband internet of things (NB-IoT) technology.
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.