iNEMI Workshop on Advanced Packaging and Its Impact on mm/Wave Applications

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ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is proud to co-sponsor the upcoming workshop, "Advanced Packaging and its Impact on mm/Wave Applications," in collaboration with the International Electronics Manufacturing Initiative (iNEMI). The workshop will be hosted by ZESTRON Americas on November 7, 2023, from 9:00 a.m. to 5:00 p.m and is free for attendees.

This full-day workshop will gather industry-based and academic researchers to discuss the challenges of advanced packaging and its intersection with high-frequency (mm/Wave) materials. The morning session will focus on the latest materials and processes for electronics packaging. In contrast, the afternoon session will feature highlights from the 5G/6G mm/Wave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO). This roadmap, a part of the NIST Advanced Manufacturing Technology (MfgTech) Roadmap program, aims to build a foundation of knowledge and expertise in the U.S. to support developing and manufacturing leading-edge 5G and 6G products.

A tour of ZESTRON’s Technical Center will be provided to attendees as well as a networking event at 2 Silos Brewing Company following the workshop. Join us for hors d'oeuvres and drinks, providing an excellent opportunity to connect with workshop speakers and fellow attendees.