The Right Approach: I Hear the Train A Comin'
It’s Only Common Sense: OCCAM—the Time Is Now
Marcy's Musings: The Growing IndustrySpirit Electronics Supports Disrupted ASIC Programs Amidst Foundry Consolidations
March 6, 2024 | Spirit ElectronicsEstimated reading time: 1 minute
Spirit Electronics, a distributor and outsourced semiconductor assembly and test (OSAT) provider, offers support for Application-Specific Integrated Circuits (ASICs) with full screen and qualification for military and space applications. Current foundry consolidation is leaving customers with last time buys or limited access to support their ASICs. Spirit can help them avoid ASIC program disruption and loss.
“Spirit Electronics is here to offer support for redesign if needed (meaning customers without a GDS2 or RTL files from their current provider),” says Spirit CEO Marti McCurdy. “We can port this over to a Texas Instruments foundry on very similar technology nodes and processes.”
Spirit is offering full-turnkey, vertically integrated services for finished goods for Space or Military qualified parts, including:
- Design: Analog, Digital, Mixed Signal and RF
- Foundry Services at Texas Instruments (TI) or other wafer foundries by customer request
- Package assembly
- Electrical test program development
- Screening
- Qualification
- Radiation Testing
- DPA (Device Physical Analysis)
- Delivery – fully qualified drop-in replacement for current ASICs.
Spirit Electronics offers foundry services supporting U.S.-based manufacturing for analog and mixed-signal integrated circuits. Spirit’s foundry access includes 45- to 130-nm technology nodes in 300 mm wafer fabs. With corporate consolidation and long-lead-time pressures demanding greater capacity from existing fabs, Spirit’s foundry services open an accessible supply chain channel for ASIC manufacturing.
Spirit recently added semiconductor veteran Dr. Naveed Sherwani to its engineering team in support of their ASIC product enablement programs. Spirit is committed to providing US Sourced, Made in the USA ASICs that support legacy replacement and advanced solutions.
Share on:
Suggested Items
US Department of Defense Selects Intel Foundry for Phase Three of RAMP-C
04/23/2024 | IntelThe U.S. Department of Defense (DoD) has awarded Intel Foundry Phase Three of its Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program.
Intel Outlines Financial Framework for Foundry Business, Sets Path to Margin Expansion
04/03/2024 | BUSINESS WIREIntel Corporation outlined a new financial reporting structure that is aligned with the company’s previously announced foundry operating model for 2024 and beyond.
Intel, Arm Team Up to Power Startups
03/25/2024 | IntelIntel and Arm have signed a memorandum of understanding that finalizes the Emerging Business Initiative, their collaboration to support the startup community.
Intel, Biden Admin Announce up to $8.5 Billion in Direct Funding Under the CHIPS Act
03/20/2024 | IntelThe Biden-Harris Administration announced today that Intel and the U.S. Department of Commerce have signed a non-binding preliminary memorandum of terms (PMT) for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act.
Cadence Digital, Custom/Analog Flows Certified for Latest Intel 18A Process Technology
02/22/2024 | Cadence Design SystemsCadence’s digital and custom/analog flows are certified on the Intel 18A process technology. Cadence® design IP supports this node from Intel Foundry, and the corresponding process design kits (PDKs) are delivered to accelerate the development of a wide variety of low-power consumer, high-performance computing (HPC), AI and mobile computing designs.