-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
May 13, 2024 | iNEMIEstimated reading time: 1 minute
Advanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit. With a unified platform, chip designers creating hyperscale computing, consumer, 5G communications, mobile and automotive applications can achieve greater productivity versus a disjointed die-by-die implementation approach.
Cadence is one of the first to provide EDA solutions for advanced packaging and heterogeneous integration and is leading the industry in delivering them to market for better design with greater efficiency. This presentation will review advanced packaging technology trends and provide an overview of Cadence’s EDA platforms that enable seamless design from front-end to back-end for the new era of advanced semiconductor packaging.
About the Speaker
Sang-Hyun Lee, Ph.D.
Sr. Principal Product Engineer
Custom IC, Packaging and PCB Development Group
Cadence Design Systems / Seoul, Korea
Sang-Hyun Lee joined Cadence in 2023 and is developing Cadence EDA tools for advanced semiconductor packages. Prior to joining Cadence, he worked at Amkor Technology and Samsung Electronics in semiconductor package development. He has led multiple projects developing advanced packages such as 2.5D packages, wafer-level fan-out packages, MCM FCBGAs, CPO (co-packaged optics) and SiPs.
Dr. Lee received his Ph.D. in Electrical Engineering from the University of Michigan (Ann Arbor, Michigan, USA). He has a master’s degree in material science from Korea Advanced Institute of Science and Technology (KAIST) (Daejon, Korea) and a bachelor’s degree in metallurgical engineering from Korea University (Seoul, Korea).
Registration
This webinar is open to industry; advance registration is required, visit iNEMI's website.
Tuesday, May 21, 2024
10:00-11:00 a.m. JST (Japan)
9:00-10:00 p.m. EDT on Monday May 20 (US)
Suggested Items
Chiplet Architecture for AI Will Create New Demands for Assembly
05/28/2024 | Nolan Johnson, SMT007 MagazineAs we look deeper into the entire AI ecosystem, it becomes clear that AI algorithms are intensely hungry for compute power. This demand for compute resources is accelerating beyond the customary rate predicted by Moore’s Law, just as traditional semiconductor fabrication methods are failing to maintain Moore’s Law. It’s a real dilemma.
Indium Corporation Expert to Present at MiNaPAD 2024
05/27/2024 | Indium CorporationIndium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, will deliver two technical presentations at the 11th Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing (MiNaPAD) Forum, taking place June 19-20 in Grenoble, France.
IDTechEx Asks if Silicon Anodes Are the Key to Mass EV Adoption
05/24/2024 | PRNewswireMaximizing energy density has been one key area of focus in electric vehicle battery development. Optimizations in cell and battery pack designs, alongside the use of higher nickel NMC and NCA cathodes, have led to steady improvement in battery energy density over the past 10-15 years.
PAC-3 MSE Integrated with Aegis Weapon System Defeats Target in Flight Test
05/22/2024 | Lockheed MartinIn partnership with multiple Department of Defense Services and Components, Lockheed Martin launched a PAC-3 Missile Segment Enhancement (MSE) interceptor from an MK-70 containerized launch platform to engage a cruise missile target in flight.
HBM3e Production Surge Expected to Make Up 35% of Advanced Process Wafer Input by End of 2024
05/20/2024 | TrendForceTrendForce reports that the three largest DRAM suppliers are increasing wafer input for advanced processes. Following a rise in memory contract prices, companies have boosted their capital investments, with capacity expansion focusing on the second half of this year.