Siemens Acquires proFPGA Product Family from PRO DESIGN
June 8, 2021 | SiemensEstimated reading time: 2 minutes
Building on the recent announcement of its next-generation Veloce™ hardware-assisted verification system for integrated circuits (ICs), Siemens Digital Industries Software has signed an agreement with Germany-based PRO DESIGN Electronic GmbH to acquire its proFPGA product family of Field Programmable Gate Array (FPGA) desktop prototyping technologies. The proFPGA product line has a track record of enabling more than 100 customers to 'shift left' in their critical hardware and software verification tasks, enabling faster time-to-market.
Bringing the proFPGA technology and team in-house can allow Siemens to more fully integrate and optimize the scalable, high-performance prototyping platform for lab and desktop environments into its Veloce hardware-assisted verification system.
Through a prior OEM relationship with PRO DESIGN, proFPGA technology is already part of Siemens' Xcelerator™ portfolio as part of its world-class suite of electronic design automation (EDA) IC verification offerings. Bringing the proFPGA technology and team in-house can allow Siemens to more fully integrate and optimize the scalable, high-performance prototyping platform for lab and desktop environments into its Veloce hardware-assisted verification system.
"Our acquisition of the proFPGA business is motivated by our growing success serving the needs of the world's leading processor and SoC creators, who demand a full suite of verification solutions tailored to their use-cases, from IP to sub-system to SoC," said Ravi Subramanian, Ph.D., senior vice president, IC Verification, Siemens Digital Industries Software. "The addition of proFPGA for desktop prototyping rounds out our Veloce Primo enterprise prototyping and Veloce Strato+ emulation solutions. We can address the full spectrum of our customers' need to have fast verification cycles available under a single, unified software programming model."
PRO DESIGN will continue to operate as an independent company and a provider of electronic engineering and manufacturing services (E²MS), offering consulting, development, layout and prototyping as well as volume production services. The company's main emphasis remains on providing its customers with FPGA-based solutions and PCIe boards for high-performance computing applications, targeting a variety of end-markets.
"With over 1,900 systems across 120 active customers in 15 countries, proFPGA technology provides a strong position for Siemens to continue to rapidly gain market share in the prototyping market segment, capitalizing on the growing use of prototyping across datacenter, 5G, artificial intelligence, automotive and internet of things (IoT) applications," said Gunnar Scholl, director of proFPGA Solutions, Siemens Digital Industries Software. "This transaction allows PRO DESIGN to remain focused on continuing to invest in and serve its E²MS business customers to the fullest extent, while allowing the proFPGA product family to grow in line with the expanded presence that Siemens has in the EDA market."
Siemens' acquisition of PRO DESIGN's proFPGA product family has closed. Terms of the transaction are not disclosed.
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.