Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Japanese Joint Research Group win Prime Minister’s Award with Ultra High-performance Computing Platform

03/25/2024 | Fujitsu
A Japanese consortium of research partners including RIKEN, the National Institute of Advanced Industrial Science and Technology (AIST), the National Institute of Information and Communications Technology (NICT), Osaka University, Fujitsu Limited, and Nippon Telegraph and Telephone Corporation (NTT) have been recognized with the prestigious Prime Minister’s Award.

Nano Dimension Announces Another Deep Learning AI Patent Granted to its DeepCube Technology

03/19/2024 | Nano Dimension
Nano Dimension Ltd., a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, announced that a patent was granted for technology developed by its industrial artificial intelligence (AI) group, DeepCube, that enables better training and optimization of decentralized deep learning-based AI models.

Siemens, NVIDIA Expand Collaboration on Generative AI for Immersive Real-time Visualization

03/19/2024 | PRNewswire
Siemens announced that it will deepen its collaboration with NVIDIA to help build the industrial metaverse. Siemens is bringing immersive visualization powered by new NVIDIA Omniverse Cloud APIs to the Siemens Xcelerator platform, driving increased use of AI-driven digital twin technology.

The Government Circuit: Driving Resiliency and Economic Security on Both Sides of the Atlantic

03/12/2024 | Chris Mitchell -- Column: The Government Circuit
Welcome to the latest edition of The Government Circuit, where I share updates on the government policy developments shaping the electronics manufacturing industry. Since the year began, we've already witnessed several significant milestones and strategic engagements that may ultimately affect the way you do business.

Department of Defense to Expand Manufacturing of PCBA for Hypersonic Weapons

03/11/2024 | U.S. DoD
The Department of Defense announced an award of $11.7 million via the Defense Production Act Investment (DPAI) Program to Ensign-Bickford Aerospace & Defense (EBAD) that will provide additional printed circuit board assembly (PCBA) production capacity at their Simsbury, CT location. EBAD will increase existing capacity and manufacturing processes to reduce cost and accelerate PCBA production.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in