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IMAPS Wrap-up: AI, Chiplets, and 3D Cube Architecture

03/22/2024 | Marcy LaRont, PCB007 Magazine
The International Microelectronics Assembly and Packaging Society, IMAPS, held its 20th Device Packaging Expo and Conference this past week in Fountain Hills, Arizona, followed immediately by a ‘Workshop on Advanced Packaging for Medical Electronics’ that continued through the remainder of Thursday. Fortunate to find myself in Texas earlier in the week, I made it for the last day of the IMAPS event and attended two excellent keynote presentations by AMD and Intel, respectively. Here are some highlights.

Hitachi High-Tech Launches High-sensitivity and High-throughput Wafer Surface Inspection System LS9300AD for Wafer Manufacturers

03/15/2024 | ACN Newswire
Hitachi High-Tech Corporation announced the launch of the LS9300AD, a new system for inspecting the front and backside of non-patterned wafer surfaces for particles and defects.

Worldwide Silicon Wafer Shipments and Revenue Fall In 2023

02/09/2024 | SEMI
Worldwide silicon wafer shipments in 2023 decreased 14.3% to 12,602 million square inches while wafer revenue contracted 10.9% to $12.3 billion over the same period, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry.

ViTrox Sets to Showcase Innovation at the 2024 SMTA Wafer-Level Packaging Symposium

02/02/2024 | ViTrox
ViTrox, which aims to be the World’s Most Trusted Technology Company, is pleased to announce its participation in the 2024 SMTA Wafer-Level Packaging Symposium at tabletop #1 in the Hyatt Regency San Francisco Airport from 13th to 14th February 2024.

DuPont Names Sanjay Kotha Global Business Director for CMP Technologies

01/24/2024 | DuPont
DuPont announced that Sanjay Kotha has been named global business director of the CMP Technologies business in DuPont Electronics & Industrial, effective Jan. 1
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