Optomec Receives 5 Machine Order for 3D Printed Electronics Production at OEM

Reading time ( words)

Optomec Inc. announced that one of its long-time production customers recently purchased another five (5) Aerosol Jet 3D Electronics Printers, bringing its total count over time to 15 systems. The $1+ million order is part of a production ramp plan that will grow to more than 25 systems over the next 12 months.

The customer is a leading global manufacturer of electronic systems and other advanced technology products, with more than $20 Billion in annual sales. They have been using Optomec’s patented Aerosol Jet 3D Printed Electronics solution in production since 2018 for advanced semiconductor packaging applications in a proprietary mobile device end-product.

“This most recent multi-system 3D Additive Electronics order is further testimony to the production viability of Optomec’s solutions,” said David Ramahi, Optomec CEO. “We look forward to supporting this industry-leading user as they continue to grow their fleet of production systems, and likewise replicating this proof statement with others in need of next-generation semiconductor packaging solutions.”

Optomec’s patented Aerosol Jet 3D Electronics Printers are an Additive Electronics solution uniquely capable of directly printing high resolution conductive circuitry, with feature sizes as small as 10 microns. The process is further differentiated by its ability to print onto non-planar substrates and fully 3-dimensional end-parts. Production applications include direct printing of 3D Antenna, 3D Sensors, Medical Electronics, Semiconductor Packaging and Display Assembly. 

A primary high-value use case in Semiconductor Packaging is the printing of 3D Interconnects to connect chips to other chips, traditional circuit boards and even directly integrated into end-products, such as wearables. In this case, the process replaces legacy wire-bonding due to its advantages in terms of smaller space claim, lower loss (especially in high frequency and mmWave) and greater mechanical reliability.

01/06/2020 | Nolan Johnson, I-Connect007

Show week for CES 2020 starts well ahead of the actual exhibition dates because it is huge. The organizers of CES state that there are more than 4,400 exhibiting companies and nearly three million net square feet of exhibit space. On the floor, you can find 307 of the 2018 Fortune Global 500 companies. Over the week, I-Connect007 Editors Dan Feinberg and Nolan Johnson will bring you some of the most interesting news, products, and announcements from 5G to IoT, semiconductor developments, autonomous vehicle technology, interconnect, fabrication materials, and much more.

06/05/2017 | DARPA

The Department of Defense’s proposed FY 2018 budget includes a $75 million allocation for DARPA in support of a new, public-private “electronics resurgence” initiative. The initiative seeks to undergird a new era of electronics in which advances in performance will be catalyzed not just by continued component miniaturization but also by radically new microsystem materials, designs, and architectures.

04/12/2016 | Marc Carter

Historians, with their 20/20 hindsight, often write about the inevitable decline and fall of kingdoms, empires, religions, organizations, governments, and all the other permanent structures we humans build.