DENSO Contributes to a Decarbonized Society by Providing SiC Power Semiconductors
November 2, 2021 | JCN NewswireEstimated reading time: 1 minute
DENSO Corporation has been contributing to spreading the use of electric vehicles, extending their mileage, and reducing CO2 emissions from vehicles by developing SiC (silicon carbide) power semiconductors, which incorporate DENSO's proprietary structures and processing technologies, and using them in its in-vehicle products.
A power semiconductor is like the muscles in the human body. It moves components, such as inverters and motors (limbs), based on commands from an ECU (brain). Typical power semiconductors used in in-vehicle products are made from silicon (Si). In comparison, SiC offers superior performance in high-temperature, high-frequency, and high-voltage environments, and helps significantly reduce the power loss, size, and weight of inverters. Thus, SiC devices have attracted attention because they accelerate the electrification of vehicles.
For example, a booster power module, which incorporates DENSO's SiC power semiconductor, is about 30% smaller in volume with 70% less power loss than a conventional product with a Si power semiconductor. As a result, products have been made smaller and vehicle fuel efficiency improved.
DENSO calls these SiC technologies "REVOSIC," conveying the idea of making "changes" in society through innovative technologies. The company has been developing a comprehensive range of technologies from wafers to power modules, and will continue R&D on REVOSIC SiC technologies and spreading their use in electric vehicles to help realize a decarbonized society.
Suggested Items
ASMC 2024 to Showcase AI, Smart Manufacturing and Sustainability to Advance Chip Industry Manufacturing Expertise
03/27/2024 | SEMIMore than 125 experts will offer insights into the latest semiconductor manufacturing strategies and methodologies as hundreds of industry stakeholders gather at the 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024), May 13-16 in Albany, New York.
SEMI 3D & Systems Summit To Spotlight Trends In Hybrid Bonding, Chiplet Design And Environmental Sustainability
03/26/2024 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024,
SEMI Applauds U.S. Chips Act Incentives for Intel Manufacturing Facilities to Bolster Semiconductor Supply
03/21/2024 | SEMISEMI, the industry association serving the global electronics design and manufacturing supply chain, applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support four new Intel Corporation semiconductor manufacturing sites in the states of Arizona, New Mexico, Ohio and Oregon.
imec Inks MoU with the intention to Establish New 300mm R&D Process Line in Spain for Specialized Chip Technologies
03/20/2024 | ImecThe Spanish government, together with the regional government of Andalusia and imec, a world-leading research and innovation hub in nanoelectronics and digital technology, announced today that they have signed a Memorandum of Understanding (MoU) outlining their intent to establish a specialized chip technology pilot line in Malaga (Andalusia).
Intel, Biden Admin Announce up to $8.5 Billion in Direct Funding Under the CHIPS Act
03/20/2024 | IntelThe Biden-Harris Administration announced today that Intel and the U.S. Department of Commerce have signed a non-binding preliminary memorandum of terms (PMT) for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act.