Siemens Collaborates with UMC on Design Kits for Automotive, Power Applications
January 24, 2022 | SiemensEstimated reading time: 2 minutes
Siemens Digital Industries Software has collaborated with United Microelectronics Corporation (UMC) to develop process design kits (PDKs) for the foundry‘s 110-nanometer (nm) and 180-nm BCD technology platforms. The new PDKs for UMC, which is a leading semiconductor foundry focused on logic and specialty technologies, are optimized for Siemens EDA’s Tanner™ custom design flow software, enabling innovative designs for a wide variety of integrated circuits (ICs) used in automotive and power applications.
Siemens’ custom IC design kits built using its Tanner software are now available for UMC’s BCD processes. The foundry’s 110-nm and 180-nm BCD platforms aim to provide best-in-class chip design kits and integrated product solutions for applications requiring power management ICs (PMICs), battery management ICs (BMICs) and wireless and fast charging ICs.
BCD technology delivers power IC designs of up to 100V operating voltage, enabling exceptional energy efficiency and high integration that combines analog circuits and digital content as well as power devices and embedded NVMs.
“Dozens of customers’ designs have been verified and entered production in the last few quarters amid robust market demand,” said Cedric Lee, senior division director and chairman of the High Voltage Product Line Management committee at UMC. “With applications becoming more sophisticated, power management solutions are also getting increasingly complex. Innovations such as Edge AI and mobility devices are driving the need for higher performance on shrinking area and low leakage. In collaboration with Siemens, UMC strives to equip our customers with the tools they need to bring their designs to life.”
Siemens‘ Tanner software features an advanced, high-performance, easy-to-use schematic and layout editor and integration with best-in-class circuit simulators and Calibre ® software, an industry-leading solution for design rule checking, parasitic extraction and physical verification. Tanner has a 30-year track record and has been used to successfully tape out thousands of designs.
“Through our collaboration with UMC, our mutual customers can adopt the certified process design kit for BCD technologies and start designing immediately with increased productivity,” said Fred Sendig, general manager of the Integrated Circuit Design Solutions group at Siemens Digital Industries Software. “These certified PDKs allow UMC customers to leverage the complete Siemens EDA custom IC design flow, enabling them to design innovative applications with confidence.”
Check out this additional content from Siemens Digital Industries Software:
- The Printed Circuit Assembler's Guide to ...Smart Data: Using Data to Improve Manufacturing by Sagi Reuven and Zac Elliott (a free eBook available for download)
- The Printed Circuit Assembler's Guide to… Advanced Manufacturing in the Digital Age by Oren Manor (a free eBook available for download)
- The Printed Circuit Designer’s Guide to… Power Integrity by Example by Fadi Deek (a free eBook available for download)
- Siemens’ free, 12-part, on-demand webinar series?“Implementing Digital Twin Best Practices From Design Through Manufacturing.”
- RealTime With ...?Siemens and Computrol: Achieving Operational Excellence in Electronics Manufacturing
- You can also view other titles in our full I-007e Book library here
Suggested Items
Real Time with... IPC APEX EXPO 2024: Exploring IPC's PCB Design Courses with Kris Moyer
04/18/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and IPC instructor Kris Moyer discuss IPC's PCB design training and education offerings. They delve into course topics such as design fundamentals, mil/aero, rigid-flex, RF design, and advanced design concepts. They also highlight material selection for high-speed design, thermal management, and dissipation techniques. The interview wraps up with details about how to access these courses online.
Cadence Unveils Palladium Z3 and Protium X3 Systems
04/18/2024 | Cadence Design SystemsThe Palladium Z3 and Protium X3 systems offer increased capacity, and scale from job sizes of 16 million gates up to 48 billion gates, so the largest SoCs can be tested as a whole rather than just partial models, ensuring proper functionality and performance.
Signal Integrity Expert Donald Telian to Teach 'Signal Integrity, In Practice' Masterclass Globally
04/17/2024 | PRLOGDonald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving Signal Integrity (SI) challenges in today's fast-paced technological landscape.
On the Line With... Podcast Talks With Cadence Expert on Manufacturing
04/18/2024 | I-Connect007In “PCB 3.0: A New Design Methodology: Manufacturing” Patrick Davis returns to the podcast to talk about design rules. As design considerations become more and more complex, so, too, do the rulesets designers must abide by.
Designing Electronics for High Thermal Loads
04/16/2024 | Akber Roy, Rush PCB Inc.Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.