SPOTLIGHT
Network Slicing: A Potential $66 Billion Opportunity for MSPs
Network slicing, a promising new vehicle that will become a fundamental 5G technology, is paving the way for the creation of new use cases...
Liquid Battery Could Lead to Flexible Energy Storage
A new type of energy storage system could revolutionise energy storage and drop the charging time of electric cars from hours to...
Reconstructing Skin on a Chip
Microfluidics could fulfill a growing need for alternatives to animal testing for the development of pharmaceuticals and cosmetics....
Battery Breakthrough: Doubling Performance with Lithium Metal That Doesn’t Catch Fire
A rechargeable battery technology developed at the University of Michigan could double the output of today’s lithium ion...
Optical Pressure Detector Could Improve Robot Skin, Wearable Devices and Touch Screens
A new type of pressure sensor based on light could allow the creation of sensitive artificial skins to give robots a better sense of touch, wearable...
Size of Semiconductor Acquisitions May Have Hit Limit
Mega-mergers become less likely because of the high-dollar value of major acquisitions, increasing scrutiny from regulators, rising protectionism...
Quantum Material is Promising ‘Ion Conductor’ for Research, New Technologies
Researchers have shown how to shuttle lithium ions back and forth into the crystal structure of a quantum material, representing a new avenue for...
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Latest EIN007
This issue Cleaning Featuring:
Getting More with Cleaning, by the I-Connect007 Editorial Team
Cleaning a No-Clean Flux: The Worst Decision You’ve Ever Made? by Eric Camden, Foresite Inc.
Whitepaper: Electronics Cleanliness Testing, by Jason Fullerton, Alpha Assembly Solutions
Towards a Data-driven Cleaning Environment, by Stephen Las Marias, I-Connect007
Is Component Testing Using ROSE Practical? by Joe Russeau, Precision Analytical Laboratory, and Mark Northrup, IEC Electronics
PCBAs: To Clean or Not Clean, by Stephen Las Marias, I-Connect007
This issue Reliability Featuring:
Reliability Takes on New Meaning and Urgency, by Patty Goldman
Building a Better Board: It Always Comes Back to Communication by the I-Connect007 Editorial Team
The IPC High-Reliability Forum for Mil-Aero and Automotive Sectors, by Happy Holden
PCBs are Moisture Sensitive Devices, by Richard Heimsch
Mechanism and Mitigation of Nickel Corrosion in ENEPIG Deposits, by George Milad, Jon Bengston and Don Gudeczauskas
This issue Packaging Trends Featuring:
Chuck Bauer Discusses the Future of Packaging, a conversation with Chuck Bauer
Standard PCB Component Families, Part 1, by Tom Hausherr
PCB Design Challenges: A Package Designer’s Perspective, by Bill Acito
BGA Fanout Routing Overview, by Christian Keller
The Whole Package, by Andy Shaughnessy