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Optimizing Solder Paste Volume for Low-temperature Reflow of BGA Packages by Keith Sweatman
Size Matters: The Effects of Solder Powder Size on Solder Paste Performance by Tony Lentz
Low-temperature SMT Solder Evaluation by Howard “Rusty” Osgood, et al.
Surface Treatment Enabling Low-temperature Soldering to Aluminum by Divyakant Kadiwala
Failures and Reliability in Soldering by Michael Gouldsmith and Zen Lee
Approaches to Overcome Nodules and Scratches on Wire-bondable Plating on PCBs by Y. K. Song, V. Bukva, and R. Wong
Microvias: Links of Faith Are Not Created Equal by Jerry Magera and J.R. Strickland
Interconnect Reliability Correlation With System Design and Transportation Stress by Dr. Paul Wang, et al.
How Changing Cleaning Technologies Affect Reliability An interview with Mike Konrad
A Guide to High-reliability PCBs From Design to Specification by Jeff Beauchamp
Avoiding CAF Failures at the IPC High-reliability Forum An interview with Terry Munson
How to Feed Test Data Back to Engineering for Process Improvement by Todd Kolmodin
Focusing on Surface Sensitivity for Reliability An interview with Elizabeth Kidd and Alex Bien
PCB Reliability: Via Design, by Greg Ziraldo, Advanced Assembly
The Difference Between Quality and Reliability, a conversation with consultant Denny Fritz
IPC Reliability Forum Wrap-up, a conversation with IPC’s Brook Sandy-Smith
Altium Designer 19.0 Features Printed Electronics Design Functions, a conversation with Nikolay Ponomarenko, Altium
Mentor Tools: Optimized for Flex and Rigid-flex Design, a conversation with David Wiens, Mentor, a Siemens business
Development of Flexible Hybrid Electronics, by Weifeng Liu, et at, Flex
26 Meters of Flex! a conversation with Philip Johnston and Jake Kelly, Trackwise Designs
