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Expanded Semiconductor Assembly and Test Facility Database Tracks OSAT and Integrated Device Manufacturers in 670 Facilities
The new edition of the Worldwide Assembly & Test Facility Database expands coverage to 670 facilities, 33% more than the previous release, including...
Qualcomm Brings the Best of On-Device AI to More Smartphones with Snapdragon 8s Gen 3
Qualcomm Technologies, Inc. announced the Snapdragon® 8s Gen 3 Mobile Platform, delivering the most sought-after 8 series capabilities to more...
LPKF Receives Major Customer Order in Solar
The technology company LPKF Laser & Electronics SE has once again received a major order in the solar market, continuing its long-standing successful collabo[1]ration with a leading international...
2024 HBM Supply Bit Growth Estimated to Reach 260%, Making Up 14% of DRAM Industry
TrendForce reports that significant capital investments have occurred in the memory sector due to the high ASP and profitability of HBM. Senior Vice...
Asia/Pacific PC Market Dropped 16.1% in 2023
The traditional PC market (Desktops, Notebooks, and Workstations) in Asia/Pacific (including Japan and China) posted a 16.1% decline in 2023 to 97.4 million units, according to the International Data Corporation (IDC)...
Hitachi High-Tech Launches High-sensitivity and High-throughput Wafer Surface Inspection System LS9300AD for Wafer Manufacturers
Hitachi High-Tech Corporation announced the launch of the LS9300AD, a new system for inspecting the front and backside of non-patterned wafer...
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Expanded Semiconductor Assembly and Test Facility Database Tracks OSAT and Integrated Device Manufacturers in 670 Facilities
March 18, 2024 | SEMI
Qualcomm Brings the Best of On-Device AI to More Smartphones with Snapdragon 8s Gen 3
March 18, 2024 | Qualcomm Technologies, Inc.
LPKF Receives Major Customer Order in Solar
March 18, 2024 | LPKF
2024 HBM Supply Bit Growth Estimated to Reach 260%, Making Up 14% of DRAM Industry
March 18, 2024 | TrendForce
Asia/Pacific PC Market Dropped 16.1% in 2023
March 18, 2024 | IDC
Hitachi High-Tech Launches High-sensitivity and High-throughput Wafer Surface Inspection System LS9300AD for Wafer Manufacturers
March 15, 2024 | ACN Newswire
PAWR Announces 5G Open RAN Testing with Mavenir at POWDER Testbed
March 15, 2024 | BUSINESS WIRE
HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation
March 15, 2024 | TrendForce
Global Shipments of PC Workstations Shrank Nearly 9% in 2023
March 15, 2024 | IDC
Intel Appoints Stacy Smith to Board of Directors
March 14, 2024 | BUSINESS WIRE
IPC APEX EXPO 2024 Pre-show Featuring:
- What’s Next Becomes Now by Dr. John Mitchell
- Dip Your Hand in the IPC APEX EXPO Candy Jar by Hannah Grace
- Electronics Circuit World Convention: A Brief History by David Bergman
- Keynote Preview: Reshaping our Engagement With the World by Shawn DuBravac
- ECWC16 Technical Conference Special Sessions by Julia Gumminger
- EMS Roundtables: Leaders Helping Each Other by Glenna Carrell
The Fabricator’s Guide to IPC APEX EXPO Featuring:
- Countdown: The Fabricator’s Guide to IPC APEX EXPO by Marcy LaRont
- What’s Next Becomes Now by John Mitchell
- Dip Your Hand in the IPC APEX EXPO Candy Jar by Hannah (Nelson) Grace
- An Exhibitor’s View of IPC APEX EXPO by Don Ball
- Professional Development: From AI to DFM by Julia Gumminger
- ECWC16 Technical Conference Special Sessions by Julia Gumminger
- Standards Development Propels the Industry Forward by Teresa Rowe
Opportunities and Challenges Featuring:
- Great Opportunities—and Challenges, with John Watson
- Being the Best Design Engineer, with Bill Hargin
- The Art of Technical Instructions, by Tim Haag
- The Art of Presenting PCB Design Courses, by Barry Olney
- PCB Designers Still Wanted, by Joe Fjelstad
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