Cadence Quantus FS Solution Achieves Certification for Samsung Foundry’s SF4, SF3E, SF3 Process Technologies
January 26, 2023 | Cadence Design Systems, Inc.Estimated reading time: 1 minute
Cadence Design Systems, Inc. announced that Samsung Foundry has certified the Cadence Quantus FS solution for its SF4, SF3E and SF3 process technologies. During the Samsung Foundry certification process, the Quantus FS solution successfully demonstrated improved accuracy (tighter mean and standard deviation) versus foundry criteria, ensuring customers can achieve optimal design accuracy and performance. In addition, the certification included verification of capacitance and resistance of BEOL and FEOL, wire via resistance variation and litho bias modeling. Customers can immediately deploy the Quantus FS solution—for library IP characterization, AMS and interface IP, sensors, high-frequency analog and mixed-signal designs, and critical nets in all custom/analog designs—and sign off with confidence.
Included with Cadence’s Quantus Extraction Solution, the Quantus FS solution is a random-walk field solver, utilizing a massively parallel architecture that handles the largest designs, provides faster throughput and linearly scales up to 1000s of CPUs. The built-in 3D capacitance field solver is cloud-ready and production-proven, offering a flexible, scalable modeling platform that enables faster implementation of the Samsung Foundry’s advanced process technologies such as SF4, SF3E and SF3. The Quantus Extraction Solution and the Quantus FS solution are part of Cadence’s broader digital full flow and support the Cadence Intelligent System Design™ strategy, enabling system-on-chip (SoC) design excellence.
“Our continued collaboration with Cadence has focused on delivering novel technologies to our mutual customers at advanced process technologies,” said Sungjae Lee, vice president of the Design Enablement team at Samsung Foundry. “Cadence’s understanding of the complex Gate-All-Around (GAA) modeling features combined with its deep engineering expertise, agility and collaborative approach is very complementary to our own approach in working with our customers. Cadence delivered on all of our accuracy and performance requirements, demonstrating tighter correlation with our golden reference data in a timely manner.”
“The best way to support our customers is to bring innovative products to market that provide efficiencies and speed time to market,” said Vivek Mishra, corporate vice president in the Digital and Signoff Group at Cadence. “We collaborated with Samsung Foundry during the initial technology development process to ensure all the requirements were met and implemented in the Quantus FS solution for easy, early customer adoption of the process technologies. The successful completion of the certification process is a win-win for Samsung Foundry and Cadence as well as for our mutual customers.”
Suggested Items
Synopsys, Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU
05/03/2024 | PRNewswireSynopsys, Inc. announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai™ full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/03/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Real Time with… IPC APEX EXPO 2024: Software Solutions for Circuit Board Challenges
05/03/2024 | Real Time with...IPC APEX EXPONolan Johnson speaks with Will Webb from Aster Technologies about their software solutions for design teams, manufacturing, test engineers, and process engineers. Aster's software addresses the increasing complexities of circuit boards and the need for alternative testing methods.
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.