Emerson Accelerates Factory Automation Capabilities With Agreement to Acquire Afag
August 17, 2023 | PRNewswireEstimated reading time: 1 minute
Emerson announced a definitive agreement to acquire Afag Holding AG, an innovative leader in electric linear motion, feeding and handling automation solutions.
Headquartered in Zell, Switzerland, Afag brings state-of-the-art technology and innovation to Emerson. The transaction will enhance Emerson's capabilities in factory automation, one of the Company's four priority adjacencies, and create a leading motion portfolio combining Afag's electric linear motion solutions with Emerson's pneumatic motion technology. Afag serves customers in attractive, growing end segments including battery manufacturing, automotive, packaging, medical, life sciences and electronics. The electric linear motion segment expands Emerson's served market by more than $9 billion and is expected to grow mid-single digits annually, supporting Emerson's long-term, profitable organic growth.
"Afag brings exciting technology that will enable Emerson to accelerate growth in our existing $900 million factory automation business," said Ram Krishnan, chief operating officer of Emerson. "As discrete and hybrid customers continue to accelerate electrification across their manufacturing processes, Afag's technology is ideally suited to provide improved energy efficiency and performance gains. We look forward to combining Afag's motion capabilities with our existing pneumatic leadership, creating a unique and differentiated solution for our customers. Afag and its employees will play an important role in enhancing Emerson's strength and innovation in factory automation."
"We are excited to join Emerson and build on its existing factory automation leadership, while further expanding our global reach," said Adrian Fuchser, chief executive officer of Afag. "Our customers rely on Afag for essential, customized systems and we are energized by this opportunity to create a more comprehensive and holistic solution for their motion needs. We share Emerson's vision of providing complete solutions in essential industries and we look forward to driving continued success as part of Emerson."
The transaction is expected to close by the end of Emerson's fiscal 2023, subject to customary closing conditions, including receipt of regulatory approvals. Terms of the transaction were not disclosed. Afag will be reported in Emerson's Discrete Automation segment.
For the transaction, Bryan Cave Leighton Paisner LLP is serving as legal advisor to Emerson.
Suggested Items
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.
TSMC Celebrates 30th North America Technology Symposium
04/29/2024 | TSMCTSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.
QinetiQ Achieves UK’s First Jet-to-Jet Teaming Between Aircraft and Autonomous Drone
04/29/2024 | QinetiQQinetiQ has successfully trialled the UK’s first Crewed-Uncrewed-Teaming demonstration between a crewed aircraft and an autonomous jet drone.
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.