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Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products

05/01/2024 | Real Time with...IPC APEX EXPO
Chris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.

indie Semiconductor Launches Advanced Smart Connectivity Solutions for In-Cabin Applications

04/23/2024 | indie Semiconductor
indie Semiconductor, Inc., an Autotech solutions innovator, has introduced a family of new high-performance video converters and retimers to enable in-cabin connectivity applications, including audio and video transport and device interfacing.

IDTechEx Discusses the Role of Printed Sensors in Mass-Digitization

04/11/2024 | PRNewswire
Integrated sensors digitizing physical interactions are vital in everyday life. From personalized user experiences to warehouse inventory management, data-driven insights are driving demand for smarter sensors — and lots of them.

MKS Introduces ESI Geode G2 CO2 Laser System for High- Precision and High-Speed HDI and mSap Via Drilling

04/09/2024 | MKS Instruments, Inc.
MKS Instruments, Inc., a global provider of technologies that transform our world, today announced the official launch of the ESI Geode™ G2 laser drill system, the next generation of the Geode™ platform for processing PCB and ICP materials. 

DuPont Unveils Pyralux ML Laminate Series, Offering High Thermal Management for Extreme Environments

04/09/2024 | DuPont
DuPont introduced the DuPont™ Pyralux® ML Series of double-sided metal-clad laminates, a unique addition to its extensive family of Pyralux® laminates for flexible and rigid-flex printed circuit boards (PCBs).
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