ECD to Showcase New M.O.L.E. EV6 Features, Preview Expanding Touchscreen Thermal Profiling Portfolio at productronica 2023
October 17, 2023 | ECDEstimated reading time: 2 minutes
Since the launch of the first-ever touch control thermal profiler, M.O.L.E.™ EV6, ECD’s new tool has enjoyed wide industry uptake and has recently integrated additional features like Bluetooth® wireless connectivity. The company announced today that during productronica 2023 in Hall A4, Booth 246/3, visitors can experience M.O.L.E. EV6 first-hand, see a preview of soon-to-be-launched profilers, demo OvenSENTINEL™ reflow monitoring technology, and learn more about the scalable RIDER soldering equipment verification portfolio.
“Maximum productivity and expansive data are the keys to process efficiency and product quality,” says ECD Electronics Division Manager, Mark Waterman. “ECD’s objective from its founding has been to deliver on these elements through robust measurement, monitoring, and analysis technologies. As the market has evolved and data acquisition and presentation made more seamless, our product line has followed suit. The ability to view and act on information immediately through M.O.L.E. EV6’s touchscreen visibility and OvenSENTINEL’s real-time reflow monitoring are two examples that have demonstrated measurable improvements in yield, quality, and cost-efficiency. For ECD, this is a journey, and we continue to add features to existing technologies and bring new solutions to the industry. We’re excited to showcase many of these at productronica 2023.”
Expanding on M.O.L.E. EV6’s feature set, ECD has integrated Bluetooth wireless technology to enable remote data acquisition of real-time profile conditions through its M.A.P. software. This Bluetooth capability, ECD’s scalable WaveRIDER™, OvenRIDER™, and SelectiveRIDER™ sensor products, and the company’s OvenSENTINEL reflow soldering continuous monitoring software will be demonstrated throughout the four-day productronica event.
With the M.O.L.E. EV platform exceeding expectations, ECD has accelerated its planned rollout of additions to the EV-generation profiler portfolio. Currently in development, new high channel count tools will offer more flexibility for the demanding process needs of each customer and address market-specific requirements. Visitors to ECD’s productronica exhibit can see a preview of the new technologies, which are set to be commercialized in early 2024.
“Particularly for high-value, high-reliability PCBs destined for mission-critical applications like automotive, aerospace, alternative energy, and high-performance computing, expanded thermal profile data points are required to ensure compliant, fail-safe manufacturing,” says Waterman. “Our newest EV-series M.O.L.E.s will offer this capability, and we look forward to sharing them with the market soon!”
Suggested Items
Real Time with… IPC APEX EXPO 2024: Exploring Electronic Card Testing and AI Integration with SPEA
05/02/2024 | Real Time with...IPC APEX EXPOLuca Fanelli, president of SPEA, and vice president Andrea Furnari discuss the company and its business units. The challenges in testing electronic cards and SPEA's solutions are discussed, and its focus on the US market is emphasized. The use of AI in testing, particularly in optical inspection and test program execution, is also examined.
All-Inclusive: PRIDE Industries Helps Employees With Disabilities to Succeed
05/01/2024 | Sandy Gentry, IPCPRIDE Industries is the leading employer of people with disabilities and those with other barriers to employment in the United States, including veterans and former foster youth. The company offers job training, placement, on-the-job coaching, and skills development for independent living. It has held IPC membership since 2000. Read more about this unique business and its connection to the electronics manufacturing industry.
Merlin Flex invests in New Schmoll Direct Imaging System
04/30/2024 | Merlin Flex LtdMerlin Flex has fully installed and commissioned its 2nd Schmoll MDI Direct Imaging system. This new machine includes a twin bed, 4 head system which enhances Merlin Flex’s direct imaging capability for its 1.4M long flexible circuits.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
TTM’s High Tech Expansion and Industry Innovation
04/30/2024 | Marcy LaRont, PCB007 MagazineTom Edman has been the CEO of TTM Technologies since 2014 and has an extensive background in electronics and manufacturing. TTM is a leading global manufacturer of technology solutions, including mission systems, RF component and RF microwave microelectronics assemblies, and quick turn and advanced technology printed circuit boards.