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Real Time with... IPC APEX EXPO 2024: Final Finishes and IC Substrate Manufacturing

04/24/2024 | Real Time with...IPC APEX EXPO
Editor Marcy LaRont and Richard DePoto, Uyemura's Business Development Manager, engage in a comprehensive discussion about the positive aspects of the show, the benefits of RAIG in final finishes, and the hurdles faced when upgrading your surface finish. Also discussed are the role of Uyemura's MEC pretreatment agents in IC substrate manufacturing and the importance of collaboration and knowledge sharing.

Uyemura Expands Technical Service Capacity in the Northeast

01/09/2024 | Uyemura
Katarina Roy has been appointed Technical Service Engineer, expanding Uyemura’s technical resources in the US northeast and the province of Ontario.  She will work from Andover, MA. and the Uyemura Tech Center in Southington, CT.

I-Connect007 Columnist George Milad Passes Away

12/20/2023 | I-Connect007 Editorial Team
I-Connect007 columnist George Milad passed away on Dec. 7, 2023, at the age of 81. George was well-known in the PCB industry for his technical expertise in physical organic chemistry. He was employed as a national accounts manager at Uyemura International Corporation, was the author of the chapters on plating and surface finishing in Printed Circuit Handbook: Seventh Edition, and had a series of publications on electrolytic plating and metallic surface finishes.

Uyemura Expands Senior Leadership Team

12/15/2021 | Uyemura
Uyemura, a world leader in specialty surface technologies, has announced a landmark expansion of its senior leadership team.

High Density Packaging User Group Announces Uyemura Membership

10/18/2021 | HDP User Group
High Density Packaging (HDP) User Group is pleased to announce that Uyemura International (Uyemura) has become a member.
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