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iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
05/13/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling.
Synopsys, Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU
05/03/2024 | PRNewswireSynopsys, Inc. announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai™ full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
HCLTech Launches EDA Solution Powered by NetApp to Accelerate EDA Workloads in the Cloud
04/11/2024 | HCLTechHCLTech, a leading global technology company, announced the launch of an Electronic Design Automation (EDA) solution in partnership with NetApp, to enable enterprises in the semiconductor industry to accelerate large EDA implementations in the hybrid cloud to significantly reduce their time-to-market, enhance the overall quality and improve the reliability of their products.
Cadence Continues ‘Left Shift’ of SI Functions
02/29/2024 | I-Connect007 Editorial TeamAt DesignCon, the I-Connect007 Editorial Team met with Brad Griffin, product marketing group director for the System Analysis Group at Cadence Design Systems. Brad explains how this analysis tool enables designers to address SI and PI issues early in the design process, before they become costly errors, and why he believes his late co-worker Dennis Nagel would be proud to see his efforts come to fruition.