Amphenol RF Offers New on-Demand 3D CAD Model Catalog
March 10, 2021 | Amphenol CorporationEstimated reading time: Less than a minute
Amphenol RF is excited to provide on-demand 3D CAD models via the B2B community powered by Cadenas PARTSolutions. With over than 800 part numbers now available and more coming, this industry-leading tool provides engineers with a convenient resource to design RF products directly in their system.
The new catalog provides a variety of RF products in an on-demand format that allows engineers access to resources in a more efficient and accessible format. Engineers now have the ability to download relevant product models in different formats for use in several different CAD software programs. This is pivotal in saving time and effort within the design process, eliminating the extensive lead time involved in requesting physical samples. These downloads include metadata which is then prepopulated into the CAD software of your choice.
Engineers also have access to a graphical user interface that features a preview of the product and allows them to spin and rotate their view. This all-new catalog is part of an effort to increase the digital tools available to our customers.
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.